Tim (Qinsong) Guo is a fourth-year student at New York University, where he is pursuing a degree in Mechanical Engineering (BS) and a minor in Music. He is a GLASS scholar at NYU Tandon and a youth scientist speaker at the 3rd World Laureates Forum. Tim has conducted multiple interdisciplinary research in the fields of computational biology, soft robotics, and additive manufacturing, publishing his findings in IEEE and the National High School Journal of Science. In his undergraduate studies, Tim intends to further his knowledge in engineering so he can apply his skills in business and technology to solving more complex social issues.
Achievements
2024 - Tandon Undergraduate Summer Research Program (UGSRP) ($6000)
2022 - NYU Tandon Global Leaders and Scholars in STEM Program (E-portfolio) ($10000/year)
2021 - Recipient of the NYU Prototyping Fund ($200)
2020 - Nominated to represent China in the 2020 Russian National Youth Science Forum
2020 - Youth scientist speaker for the Third World Laureates Forum
2020 - Soong Ching Ling Awards for Children's Inventions First Prize
2015-2019 - Shanghai Adolescent Science and Technology Innovation Fair:
2015: 2nd, 3rd prize / 2017: 1st prize. 2000 RMB special prize / 2019: 2nd prize
2017 - Tae-kwon-do Black Belt Don 1
2017 - Piano ABRSM-8 Certificate
2016 - INTEL IoT Roadshow Shanghai First Prize (2000 dollars)
2024 - Exchange Winter Semester at Indonesia ITB
2023 - Travelling across europe with friends during the exchange semester
2023 - Recoating system design for vat photopolymerization printer at the Technical University of Denmark
2022 - Attending the CAMX 2022 Expo
2022 - Member of the NYU Sixth Sense Vertically Integrated Project Team
2021 - Giving a speech as the head boy at the high school graduation ceremony
2020 - Showcasing the bionic snake at the Third World Laureates Forum
2020 - Presenting at the Third World Laureates Forum
2019 - Participant of the leading entrepreneurship program LaunchX
2018 - Presenting 3d printing to 100+ students at the community center
2016 - Youngest participant of the INTEL IoT Roadshow Shanghai
2014 - Experimenting wing geometries with a homemade wind tunnel